The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Jul. 19, 2006
Applicants:

Kazunori Ishikawa, Fukuyama, JP;

Makoto Uchida, Kita-ku, JP;

Yasumasa Akatsuka, Sanyoonoda, JP;

Inventors:

Kazunori Ishikawa, Fukuyama, JP;

Makoto Uchida, Kita-ku, JP;

Yasumasa Akatsuka, Sanyoonoda, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08G 69/32 (2006.01); B32B 27/34 (2006.01); B32B 15/092 (2006.01); B32B 27/38 (2006.01); H05K 1/03 (2006.01); C08G 59/54 (2006.01); C08G 69/26 (2006.01); C08L 77/10 (2006.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0353 (2013.01); B32B 27/08 (2013.01); B32B 27/34 (2013.01); B32B 27/38 (2013.01); C08G 59/54 (2013.01); C08G 69/265 (2013.01); C08G 69/32 (2013.01); C08L 77/10 (2013.01); B32B 2457/08 (2013.01); Y10T 428/31511 (2015.04); Y10T 428/31515 (2015.04); Y10T 428/31522 (2015.04); Y10T 428/31725 (2015.04);
Abstract

Provided herein are a phenolic hydroxyl group-containing aromatic polyamide resin and a resin composition containing the resin, such as an epoxy resin composition containing an epoxy resin. The phenolic hydroxyl group-containing aromatic polyamide resin has a structure represented by the following formula (1): wherein m and n are average values satisfying the following formula: 0.005≦n/(m+n)<0.05, m+n is a positive value of 2 to 200, Aris a bivalent aromatic group, Aris a phenolic hydroxyl group-containing bivalent aromatic group, and Aris a bivalent aromatic group. Such a phenolic hydroxyl group-containing aromatic polyamide resin has a low ionic impurity content and improved adhesive properties as well as excellent properties inherent in conventional phenolic hydroxyl group-containing aromatic polyamide resins, such as the ability to allow a cured epoxy resin composition to have excellent flexibility, electrical properties, flame retardancy, and the like.


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