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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9478791 B1

PDFFull Text
Date of Patent:
Oct. 25, 2016

Filed:

Aug. 28, 2013

Method for forming pattern, structural body, method for producing comb-shaped electrode, and secondary cell

Applicant:

Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;

Inventors:

Kaoru Ishikawa, Kawasaki, JP;

Takahiro Asai, Kawasaki, JP;

Assignee:

TOKYO OHKA KOGYO CO., LTD., Kawasaki-Shi, JP;

Attorney:

Knobbe Martens Olson & Bear LLP

Primary Examiner:

James M Mellott

Int. Cl.
CPC ...
G03F 7/00 (2006.01); H01M 6/40 (2006.01); H01M 4/04 (2006.01); H01M 4/13 (2010.01); H01M 4/70 (2006.01); H01M 4/139 (2010.01); H01M 10/058 (2010.01); G03F 7/40 (2006.01); H01L 21/288 (2006.01); H01M 10/052 (2010.01); H01M 10/0565 (2010.01); H01M 4/02 (2006.01); H01L 21/768 (2006.01); G03F 7/12 (2006.01);
U.S. Cl.
CPC ...
H01M 4/0414 (2013.01); G03F 7/0035 (2013.01); H01M 4/0404 (2013.01); H01M 4/13 (2013.01); H01M 4/139 (2013.01); H01M 4/70 (2013.01); H01M 6/40 (2013.01); H01M 10/058 (2013.01); G03F 7/0037 (2013.01); G03F 7/12 (2013.01); G03F 7/40 (2013.01); H01L 21/288 (2013.01); H01L 21/76885 (2013.01); H01M 10/052 (2013.01); H01M 10/0565 (2013.01); H01M 2004/025 (2013.01); Y02E 60/122 (2013.01); Y02P 70/54 (2015.11);
Abstract

A method for forming a pattern multiple patterns of identical or different pattern materials can be formed on a support in a short time, a structural body, a method for producing a comb-shaped electrode, and a secondary cell. The pattern forming method, in which n patterns (n≧2) are formed on a support, includes forming a first resist layer on the support surface; repeating: forming a guide hole through all resist layers by exposure and development, filling a kth pattern material into the guide hole by a screen printing process, and forming a (k+1)th resist layer on the kth resist layer and the pattern materials, regarding kth (k=1 to n−1) pattern material and resist layer in order of k=1 to n−1; performing guide hole formation and nth pattern material filling similarly, and removing all of the resist layers.

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