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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9478722 B1

PDFFull Text
Date of Patent:
Oct. 25, 2016

Filed:

Oct. 05, 2015

Light emitting device and method for manufacturing same

Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Yoshiaki Sugizaki, Kanagawa-ken, JP;

Hideki Shibata, Kanagawa-ken, JP;

Masayuki Ishikawa, Kanagawa-ken, JP;

Hideo Tamura, Kanagawa-ken, JP;

Tetsuro Komatsu, Kanagawa-ken, JP;

Akihiro Kojima, Kanagawa-ken, JP;

Assignee:

KABUSHIKI KAISHA TOSHIBA, Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Marvin Payen

Assistant Examiner:

Jeremy Joy

Int. Cl.
CPC ...
H01L 33/36 (2010.01); H01L 33/48 (2010.01); H01L 21/60 (2006.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/34 (2010.01); H01L 33/44 (2010.01); H01L 33/50 (2010.01); H01L 33/00 (2010.01); H01L 33/38 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/11 (2013.01); H01L 24/12 (2013.01); H01L 24/16 (2013.01); H01L 25/0753 (2013.01); H01L 33/34 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 24/02 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 33/0079 (2013.01); H01L 33/38 (2013.01); H01L 33/58 (2013.01); H01L 2224/02375 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05012 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05571 (2013.01); H01L 2224/06132 (2013.01); H01L 2224/06152 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/00013 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12042 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method for manufacturing a light emitting device includes forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a translucent substrate. A dielectric film on a second surface side opposite to the first surface of the multilayer body is formed having first and second openings on a p-side electrode and an n-side electrode. A seed metal on the dielectric film and an exposed surface of the first and second openings form a p-side metal interconnect layer and an n-side metal interconnect layer separating the seed metal into a p-side seed metal and an n-side seed metal by removing a part of the seed metal. A resin is formed in a space from which the seed metal is removed.

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