The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Feb. 27, 2015
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Minghao Jin, Villach, AT;

Oliver Blank, Villach, AT;

Rudolf Rothmaler, Villach, AT;

Johannes Baumgartl, Riegersdorf, AT;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/66 (2006.01); H01L 21/02 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66666 (2013.01); H01L 21/02238 (2013.01); H01L 21/02255 (2013.01); H01L 21/02381 (2013.01); H01L 21/02532 (2013.01); H01L 29/4916 (2013.01); H01L 29/66545 (2013.01);
Abstract

A method of forming trench electrode structures includes forming a first dielectric layer on a semiconductor substrate, forming a second layer above the first dielectric layer and forming an opening which extends through the second layer and the first dielectric layer to the semiconductor substrate such that part of the semiconductor substrate is uncovered. The method further comprises forming an epitaxial layer on the uncovered part of the semiconductor substrate, removing the second layer after forming the epitaxial layer and filling an open space formed by removing the second layer with an electrically conductive material. The electrically conductive material forms an electrode which is laterally surrounded by the epitaxial layer.


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