logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9478508 B1

PDFFull Text
Date of Patent:
Oct. 25, 2016

Filed:

Jun. 08, 2015

Microwave integrated circuit (mmic) damascene electrical interconnect for microwave energy transmission

Applicant:

Raytheon Company, Waltham, MA (US);

Inventors:

Jeffrey R. LaRoche, Austin, TX (US);

John P. Bettencourt, Danvers, MA (US);

Thomas E. Kazior, Sudbury, MA (US);

Kelly P. Ip, Lowell, MA (US);

Assignee:

Raytheon Company, Waltham, MA (US);

Attorney:

Daly, Crowley, Mofford & Durkee, LLP

Primary Examiner:

Fernando L Toledo

Assistant Examiner:

Adam S Bowen

Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/528 (2013.01); H01L 23/5329 (2013.01); H01L 23/53238 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6683 (2013.01);
Abstract

A semiconductor structure having a semiconductor layer having an active device therein. A dielectric structure is disposed over the semiconductor layer, such dielectric structure having open ended trench therein. An electrical interconnect level is disposed in the trench and electrically connected to the active device. A plurality of stacked metal layers is disposed in the trench. The stacked metal layers have disposed on bottom and sidewalls thereof conductive barrier metal layers.

Find Patent Forward Citations

Quick Actions:

LaRoche, Jeffrey. (2016). Microwave integrated circuit (mmic) damascene electrical interconnect for microwave energy transmission (U.S. Patent No. 9478508). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9478508

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…