The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
May. 21, 2013
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventor:
Nicholas G. Clore, Essex Junction, VT (US);
Assignee:
GLOBALFOUNDRIES INC., Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 21/50 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/24 (2013.01); H01L 21/50 (2013.01); H01L 23/04 (2013.01); H01L 23/10 (2013.01); H01L 23/36 (2013.01); H01L 23/373 (2013.01); H01L 23/3735 (2013.01); H01L 23/40 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A method for fabrication of a lid for a microelectronic device is described, wherein the microelectronic device comprises of a die and a laminate. A gel is formed having a coefficient of thermal expansion (CTE) within a threshold percentage value of either a CTE of the die or a CTE of the laminate of the microelectronics device. A metal piece is inserted into the gel to form a lid.