The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Jul. 30, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Chung-Hsing Wang, Baoshan Township, TW;

King-Ho Tam, Zhudong Township, TW;

Yen-Pin Chen, Taipei, TW;

Wen-Hao Chen, Hsinchu, TW;

Chung-Kai Lin, Taipei, TW;

Chih-Hsiang Yao, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5081 (2013.01); G06F 17/5009 (2013.01);
Abstract

A method of generating a techfile corresponding to a predetermined fabrication process is disclosed. The method includes determining a typical value and a corner variation value usable to model an electrical characteristic of a layer of back end of line (BEOL) features to be fabricated by the predetermined fabrication process, based on measurement of one or more sample integrated circuit chips fabricated by the predetermined fabrication process. A reduced variation value is calculated based on the corner variation value and a scaling factor. The techfile is generated based on the typical value and the reduced variation value.


Find Patent Forward Citations

Loading…