The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 25, 2016

Filed:

Feb. 23, 2012
Applicants:

Yoriyuki Suwa, Nagano, JP;

Kenji Kawamura, Nagano, JP;

Syuzo Aoki, Nagano, JP;

Masao Nakazawa, Nagano, JP;

Susumu Arai, Nagano, JP;

Inventors:

Yoriyuki Suwa, Nagano, JP;

Kenji Kawamura, Nagano, JP;

Syuzo Aoki, Nagano, JP;

Masao Nakazawa, Nagano, JP;

Susumu Arai, Nagano, JP;

Assignees:

SHINKO ELECTRIC INDUSTRIES CO., LTD, Nagano-Shi, JP;

SHINSHU UNIVERSITY, Matsumoto-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28F 13/18 (2006.01); C25D 15/00 (2006.01); C25D 3/02 (2006.01); C25D 3/12 (2006.01); F28F 7/00 (2006.01);
U.S. Cl.
CPC ...
C25D 15/00 (2013.01); C25D 3/02 (2013.01); C25D 3/12 (2013.01);
Abstract

In one embodiment, there is provided a composite plating liquid. The composite plating liquid includes: a plating metal salt; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; a carbon nanotube; and a dispersant. Also, there is provided a plating method of plating a member using the composite plating liquid, and a composite plating film formed by the plating method.


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