The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 2016
Filed:
May. 29, 2015
Applicant:
Advanced Technology Materials, Inc., Danbury, CT (US);
Inventors:
Assignee:
Advanced Technology Materials, Inc., Danbury, CT (US);
Primary Examiner:
Int. Cl.
CPC ...
C11D 11/00 (2006.01); C11D 3/00 (2006.01); C11D 7/06 (2006.01); C11D 7/26 (2006.01); C11D 7/32 (2006.01); H01L 21/02 (2006.01); C11D 3/04 (2006.01); C11D 3/20 (2006.01); C11D 3/28 (2006.01);
U.S. Cl.
CPC ...
C11D 11/0047 (2013.01); C11D 3/0042 (2013.01); C11D 3/044 (2013.01); C11D 3/2065 (2013.01); C11D 3/2086 (2013.01); C11D 3/2096 (2013.01); C11D 3/28 (2013.01); C11D 7/06 (2013.01); C11D 7/265 (2013.01); C11D 7/267 (2013.01); C11D 7/3209 (2013.01); C11D 7/3218 (2013.01); C11D 7/3281 (2013.01); H01L 21/02074 (2013.01);
Abstract
A cleaning agent for a microelectronic device provided with metal wiring, which has an excellent ability to remove polishing particle residues derived from a polishing agent and an excellent ability to remove metallic residues on an insulating film, and has excellent anticorrosiveness to the metal wiring. The cleaning agent is used at a step subsequent to chemical mechanical polishing in a manufacturing process of a microelectronic device in which a metal wiring, e.g., copper or tungsten, is formed.