The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Nov. 06, 2012
Applicant:

El-seed Corporation, Nagoya-shi, JP;

Inventors:

Atsushi Suzuki, Nagoya, JP;

Koichi Naniwae, Nagoya, JP;

Toshiyuki Kondo, Nagoya, JP;

Midori Mori, Nagoya, JP;

Fumihara Teramae, Nagoya, JP;

Assignee:

EL-SEED Corporation, Nagoya-shi, Aichi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 33/00 (2010.01); H01L 33/22 (2010.01); H01L 33/12 (2010.01);
U.S. Cl.
CPC ...
H01L 33/58 (2013.01); H01L 33/005 (2013.01); H01L 33/007 (2013.01); H01L 33/22 (2013.01); H01L 33/12 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0083 (2013.01);
Abstract

Provided are an etching method capable of increasing an etching selectivity between a subject material and a resist, a sapphire substrate processed using the etching method, and a light-emitting device including the sapphire substrate. An etching method using a plasma etching apparatus includes: a resist film forming step of forming a resist film on a subject material; a pattern forming step of forming a predetermined pattern on the resist film; a resist degenerating step of exposing the resist film on which the pattern is formed to plasma under a predetermined degeneration condition to degenerate the resist film and increase an etching selectivity; and a subject material etching step of exposing the subject material to plasma under an etching condition different from the degeneration condition to etch the subject material using the resist film having an increased etching selectivity as a mask.


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