The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Jun. 20, 2015
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Martin Standing, Villach, AT;
Johannes Schoiswohl, San Jose, CA (US);
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 25/00 (2006.01); H01L 23/32 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 23/32 (2013.01); H01L 23/64 (2013.01); H01L 25/16 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/19103 (2013.01);
Abstract
A method for manufacturing an electronic module is disclosed. In an embodiment the method includes providing a passive component having an upper surface of a first area, and electrically and mechanically attaching a first semiconductor chip having a lower surface of a second area that is smaller than the first area to the passive component, wherein the lower surface of the first semiconductor chip is arranged on the upper surface of the passive component, and wherein the first semiconductor chip comprises a vertical field-effect transistor.