The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Feb. 22, 2013
Applied Materials, Inc., Santa Clara, CA (US);
Kun Xu, Sunol, CA (US);
Ingemar Carlsson, Milpitas, CA (US);
Tzu-Yu Liu, San Jose, CA (US);
Shih-Haur Shen, Sunnyvale, CA (US);
Boguslaw A. Swedek, Cupertino, CA (US);
Wen-Chiang Tu, Mountain View, CA (US);
Lakshmanan Karuppiah, San Jose, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A method of controlling polishing includes storing a desired ratio representing a ratio for a clearance time of a first zone of a substrate to a clearance time of a second zone of the substrate. During polishing of a first substrate, an overlying layer is monitored, a sequence of measurements is generated, and the measurements are sorted a first group associated with the first zone of the substrate and a second group associated with the second zone on the substrate. A first time and a second time at which the overlying layer is cleared is determined based on the measurements from the first group and the second group, respectively. At least one adjusted polishing pressure is calculated for the first zone based on a first pressure applied in the first zone during polishing the first substrate, the first time, the second time, and the desired ratio.