The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 2016
Filed:
Aug. 23, 2012
Applicants:
Tien-chih Cheng, Zhubei, TW;
Ying Zhang, Hsinchu, TW;
Shu-huei Suen, Zhudong Township, Hsinchu County, TW;
Chen-chiao Kao, New Taipei, TW;
Inventors:
Tien-Chih Cheng, Zhubei, TW;
Ying Zhang, Hsinchu, TW;
Shu-Huei Suen, Zhudong Township, Hsinchu County, TW;
Chen-Chiao Kao, New Taipei, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05C 13/00 (2006.01); B23B 31/28 (2006.01); B05D 1/02 (2006.01); B05C 11/00 (2006.01); B05D 3/12 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6875 (2013.01); H01L 21/68757 (2013.01); Y10T 279/23 (2015.01);
Abstract
A wafer support device is provided. The wafer support device includes a plurality of support portions; and a bottom area located among the support portions, wherein the bottom area has a protective layer formed thereon. A method for processing a working surface of a wafer support device is also provided.