The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Mar. 11, 2011
Applicants:

Barry Gregerson, Deephaven, MN (US);

Jason Steffens, Shakopee, MN (US);

Russ V. Raschke, Chanhassen, MN (US);

Inventors:

Barry Gregerson, Deephaven, MN (US);

Jason Steffens, Shakopee, MN (US);

Russ V. Raschke, Chanhassen, MN (US);

Assignee:

ENTEGRIS, INC., Billerica, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/673 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67369 (2013.01); H01L 21/67383 (2013.01); H01L 21/67386 (2013.01);
Abstract

An improved wafer support mechanism in a wafer container useful for carrying a plurality of axially aligned thin mostly circular wafer substrates. The container includes a cassette that has a plurality of adjacently disposed teeth for receiving the substrates, wherein each rib member is continuous from the cassette open top to the cassette open bottom, a removable top cover portion, a removable bottom cover portion, a cushion assembly removably attached to the container top cover and another cushion assembly removably located in the container bottom cover and held in place by the weight of the wafer cassette. The top cushions are formed of individual segments having an extended lead-in feature at the end of each segment, spring sections in each segment and each segment has a V-shaped cross section to receive the wafer edge. The top and bottom cushions are installed in the top and bottom container covers respectively, and extend the wafer support to approximately the entire circumference of each wafer.


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