The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Mar. 28, 2014
Applicants:

Mark D. Hall, Austin, TX (US);

Mehul D. Shroff, Austin, TX (US);

Inventors:

Mark D. Hall, Austin, TX (US);

Mehul D. Shroff, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/337 (2006.01); H01L 21/3213 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01); H01L 29/788 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 21/32133 (2013.01); H01L 27/11534 (2013.01); H01L 29/42328 (2013.01); H01L 29/42332 (2013.01); H01L 29/66545 (2013.01); H01L 29/66825 (2013.01); H01L 29/7881 (2013.01);
Abstract

A method of forming a semiconductor device in an NVM region and in a logic region uses a semiconductor substrate and includes forming a gate region fill material over the NVM region and the logic region. The gate region fill material is patterned over the NVM region to leave a first patterned gate region fill material over the NVM region. An interlayer dielectric is formed around the first patterned gate region fill material. A first portion of the first patterned gate region fill material is removed to form a first opening and leaving a second portion of the first patterned gate region fill material. The first opening is laterally adjacent to the second portion. The first opening is filled with a charge storage layer and a conductive material that includes metal overlying the charge storage layer.


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