The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 2016

Filed:

Jul. 30, 2013
Applicant:

Globalfoundries, Inc., Grand Cayman, KY;

Inventors:

Ernesto Gene de la Garza, Dresden, DE;

Martin O'Toole, Dresden, DE;

Assignee:

GLOBALFOUNDRIES, INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/20 (2006.01); H05K 3/34 (2006.01); H05K 13/04 (2006.01); H01L 23/00 (2006.01); C23C 28/00 (2006.01); C23C 28/02 (2006.01); H05K 3/38 (2006.01); B32B 15/04 (2006.01); B32B 3/10 (2006.01);
U.S. Cl.
CPC ...
B23K 1/20 (2013.01); C23C 28/00 (2013.01); C23C 28/02 (2013.01); H01L 24/05 (2013.01); H01L 24/43 (2013.01); H01L 24/48 (2013.01); H05K 3/385 (2013.01); H01L 24/45 (2013.01); H01L 2224/43 (2013.01); H01L 2224/451 (2013.01); H01L 2224/85365 (2013.01); H01L 2224/85385 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/0392 (2013.01); H05K 2203/1105 (2013.01); Y10T 428/12396 (2015.01);
Abstract

Methods of effecting bond adhesion between metal structures, methods of preparing articles including bonded metal structures, and articles including bonded metal structures are provided herein. In an embodiment, a method of effecting bond adhesion between metal structures includes forming a first metal structure on a substrate. The first metal structure includes grains that have a {111} crystallographic orientation, and the first metal structure has an exposed contact surface. Formation of an uneven surface topology is induced in the exposed contact surface of the first metal structure after forming the first metal structure. A second metal structure is bonded to the exposed contact surface of the first metal structure after inducing formation of the uneven surface topology in the exposed contact surface.


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