Electrostatic chuck device

Abstract

An electrostatic chuck device is provided in which there is no concern that a plate-shaped sample may be deformed when adsorbing the plate-shaped sample or when detaching the plate-shaped sample, the temperature of the plate-shaped sample is uniformized, and particles are not easily produced. In an electrostatic chuck deviceprovided with an electrostatic chuck sectionwhich has a placement plate, an upper surfaceof which is a placement surface on which a plate-shaped sample W such as a semiconductor wafer is placed, a support plateintegrated with the placement plate, and an internal electrode for electrostatic adsorptionand an insulating material layerwhich are provided between the placement plateand the support plate, an annular projection portionis provided at a peripheral border portion on the upper surface, a plurality of projection portionshaving the same height as the height of the annular projection portionare provided in an area surrounded by the annular projection portionof the upper surface, and an upper end portion of the annular projection portionand an upper end portion of each of the plurality of projection portionsare located on a concave surfacewith a central portion of the upper surfaceas a basal plane.