The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2016
Filed:
Jun. 14, 2011
Zhi Zeng, Beijing, CN;
Xun Wang, Beijing, CN;
Ning Tao, Beijing, CN;
Lichun Feng, Beijing, CN;
Cunlin Zhang, Beijing, CN;
Zhi Zeng, Beijing, CN;
Xun Wang, Beijing, CN;
Ning Tao, Beijing, CN;
Lichun Feng, Beijing, CN;
Cunlin Zhang, Beijing, CN;
CAPITAL NORMAL UNIVERSITY, Beijing, CN;
BEIJING WAITEKSIN ADVANCED TECHNOLOGY CO., LTD., Beijing, CN;
CHONGQING NORMAL UNIVERSITY, Chongqing, CN;
Abstract
A method for measuring thickness or defect depth by pulsed infrared thermal wave technology is described. The method includes heating a measured object by pulsed heating devices, and at the same time, obtaining a thermal image sequence on the surface of the measured object by an infrared thermography device, and storing the thermal image sequence in a general-purpose memory. The method also includes multiplying a temperature-time curve at every point of the thermal image sequence by a corresponding time, thereby obtaining a new curve. The method also includes calculating a first-order differential and obtaining a peak time thereof. The method also includes use of one or more formulas to thereby determine the thickness or the defect depth of the measured object.