The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 2016
Filed:
Sep. 28, 2012
Applicant:
Deca Technologies Inc.;
Inventors:
Christopher M. Scanlan, Chandler, AZ (US);
Ferdinand Aldas, Cavite, PH;
Kenneth C. Blaisdell, Gilbert, AZ (US);
Cheryl R. Abanes, Binan, PH;
Assignee:
DECA Technologies Inc., Tempe, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 17/06 (2006.01); H01L 21/687 (2006.01); C25D 17/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
C25D 17/001 (2013.01); C25D 17/06 (2013.01); H01L 21/68721 (2013.01); H01L 23/3114 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A wafer plating jig system comprising an electrically insulating wafer plating jig base having a plurality of overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size and an electrically conductive cover plate comprising an open center surrounded by a support, the cover plate comprising an electrical conductor surrounding the open center and with at least one of the overlapping cavities of the wafer plating jig base.