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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9461001 B1

PDFFull Text
Date of Patent:
Oct. 04, 2016

Filed:

Jul. 22, 2015

Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Ming-Horng Tsai, Kaohsiung, TW;

Wei-Yu Chen, Kaohsiung, TW;

Chun-Chia Lee, Kaohsiung, TW;

Huan Wun Li, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaosiung, TW;

Attorneys:

Foley & Lardner LLP

Cliff Z. Liu

Angela D. Murch

Primary Examiner:

Mohsen Ahmadi

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 21/52 (2006.01); H01L 21/26 (2006.01); H01L 21/768 (2006.01); H01L 23/04 (2006.01); H01L 23/64 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H02J 7/02 (2016.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4817 (2013.01); H01L 21/52 (2013.01); H01L 21/56 (2013.01); H01L 21/76892 (2013.01); H01L 23/04 (2013.01); H01L 23/3107 (2013.01); H01L 23/5386 (2013.01); H01L 23/645 (2013.01); H02J 7/025 (2013.01);
Abstract

The present disclosure relates to a semiconductor device package which includes a carrier, an electronic component, conductive elements, a package body, a shield, a magnetic insulating layer, and a patterned conductive layer. The carrier has a top surface on which the electronic component is disposed. The conductive elements are disposed on the top surface of the carrier. The package body is disposed on the top surface of the carrier and encapsulates the electronic component and a portion of each of the conductive elements. The shield is disposed on the package body and covers an exterior of the package body. The magnetic insulating layer is disposed on a top surface of the shield. The patterned conductive layer is disposed on the magnetic insulating layer. Each of the conductive elements electrically connects the patterned conductive layer to the electronic component.

Find Patent Forward Citations

Tsai, Ming-Horng. (2016). Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same (U.S. Patent No. 9461001). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9461001

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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