The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2016

Filed:

Sep. 06, 2011
Applicants:

Szu-chia Huang, Toufen Township, Miaoli County, TW;

Jhih Jie Shao, Toufen Township, Miaoli County, TW;

Tang-hsuan Chung, Kaohsiung, TW;

Huan Chi Tseng, Hsinchu, TW;

Inventors:

Szu-Chia Huang, Toufen Township, Miaoli County, TW;

Jhih Jie Shao, Toufen Township, Miaoli County, TW;

Tang-Hsuan Chung, Kaohsiung, TW;

Huan Chi Tseng, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 31/30 (2006.01);
U.S. Cl.
CPC ...
G01R 31/30 (2013.01);
Abstract

The present disclosure provides a method for testing a semiconductor device. The method includes providing a test unit and an electronic circuit that is electrically coupled to the test unit. The method includes performing a multi-dimensional sweeping process. The multi-dimensional sweeping process includes sweeping a plurality of different electrical parameters across their respective ranges. The method includes monitoring a performance of the electronic circuit during the multi-dimensional sweeping process. The monitoring includes identifying optimum values of the different electrical parameters that yield a satisfactory performance of the electronic circuit. The method includes testing the test unit using the optimum values of the different electrical parameters.


Find Patent Forward Citations

Loading…