The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Aug. 24, 2010
Kilian Arnd, Berlin, DE;
Jens Wegricht, Berlin, DE;
Isabel-roda Hirsekorn, Paulinenaue, DE;
Hans Jurgen Schreier, Velten, DE;
Kilian Arnd, Berlin, DE;
Jens Wegricht, Berlin, DE;
Isabel-Roda Hirsekorn, Paulinenaue, DE;
Hans Jurgen Schreier, Velten, DE;
Atotech Deutschland GmbH, Berlin, DE;
Abstract
The invention relates to a method for electroless (immersion) plating of tin and tin alloys having a thickness of ≧1 μm as a final finish in the manufacture of printed circuit boards, IC substrates, semiconductor wafers and the like. The method utilizes an electroless plated sacrificial layer of copper between the copper contact pad and the electroless plated tin layer which is dissolved completely during tin plating. The method compensates the undesired loss of copper from a contact pad during electroless plating of thick tin layers.