The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 27, 2016

Filed:

Nov. 19, 2014
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-ken, JP;

Inventor:

Tomoki Kobayashi, Nagano, JP;

Assignee:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/28 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 3/284 (2013.01); H05K 1/0218 (2013.01); H05K 1/186 (2013.01); H05K 3/368 (2013.01); H05K 2201/042 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/086 (2013.01); H05K 2201/10234 (2013.01);
Abstract

An electronic device includes wiring substrates stacked upon one another with a connection member arranged between adjacent wiring substrates, in which the connection member electrically connects the adjacent wiring substrates, and each wiring substrate includes a solder resist layer as a lowermost layer, electronic components mounted on the wiring substrates so that at least one of the electronic components is mounted on each wiring substrate, a first magnetic thin film covering a lower surface of the solder resist layer of an upper one of the adjacent wiring substrates, a first encapsulation resin formed on an upper surface of the uppermost wiring substrate and encapsulates the electronic component mounted on the uppermost wiring substrate, and a second magnetic thin film that entirely covers an upper surface of the first encapsulation resin and covers a lower surface of the solder resist layer on the lowermost wiring substrates.


Find Patent Forward Citations

Kobayashi, Tomoki. (2016). Electronic device (U.S. Patent No. 9456504). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9456504

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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