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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9455192 B1

PDFFull Text
Expired
Date of Patent:
Sep. 27, 2016

Filed:

Mar. 26, 2014

Kerf preparation for backside metallization

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Michael Roesner, Villach, AT;

Manfred Engelhardt, Villach-Landskron, AT;

Johann Schmid, Villach, AT;

Gudrun Stranzl, Goedersdorf, AT;

Joachim Hirschler, Villach, AT;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:

Slater Matsil, LLP

Primary Examiner:

Kevin M Picardat

Int. Cl.
CPC ...
H01L 21/46 (2006.01); H01L 21/78 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7806 (2013.01); H01L 21/02057 (2013.01); H01L 21/31133 (2013.01); H01L 21/31138 (2013.01); H01L 21/76879 (2013.01); H01L 21/76898 (2013.01); H01L 21/78 (2013.01); H01L 24/32 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/10157 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12044 (2013.01);
Abstract

In accordance with an embodiment of the present invention, a method of forming a semiconductor device includes attaching a substrate to a carrier using an adhesive component and forming a through trench through the substrate to expose the adhesive component. At least a portion of the adhesive component is etched and a metal layer is formed over sidewalls of the through trench.

Find Patent Forward Citations

Roesner, Michael. (2016). Kerf preparation for backside metallization (U.S. Patent No. 9455192). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9455192

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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