The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2016
Filed:
Dec. 17, 2015
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Oleg Gluschenkov, Tannersville, NY (US);
Andrew J. Martin, Carmel, NY (US);
Joyeeta Nag, Wappingers Falls, NY (US);
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/324 (2006.01); H01L 21/768 (2006.01); H01L 21/67 (2006.01); B23K 26/20 (2014.01);
U.S. Cl.
CPC ...
H01L 21/76894 (2013.01); B23K 26/20 (2013.01); H01L 21/67115 (2013.01);
Abstract
Disclosed is a process of annealing through silicon vias (TSVs) or other deeply buried metallic interconnects using a back side laser annealing process. The process provides several advantages including sufficient grain growth and strain relief of the metal such that subsequent thermal processes do not cause further grain growth; shorter anneal times thereby reducing cycle time of 3D device fabrication; and reduced pattern sensitivity of laser absorption.