The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2016
Filed:
Jul. 24, 2014
Disco Corporation, Tokyo, JP;
Takayuki Masada, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A crack and thickness detecting apparatus for detecting a crack in a wafer and also detecting the thickness of the wafer. The apparatus includes an ultrasonic oscillating unit oscillating a first ultrasonic wave toward the upper surface of the wafer at a predetermined incident angle, an ultrasonic oscillating and receiving unit oscillating a second ultrasonic wave toward the upper surface of the wafer in a direction perpendicular thereto and also receiving reflected waves obtained by the reflection of the first and second ultrasonic waves from the wafer, a crack determining unit determining whether or not the crack is present in the wafer according to the first reflected wave, and a thickness calculating unit calculating the thickness of the wafer according to the second reflected wave. The ultrasonic oscillating and receiving unit alternately receives the first reflected wave and the second reflected wave.