The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Jan. 10, 2015
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
CYNTEC Co., Ltd., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/18 (2006.01); H01L 23/64 (2006.01); H01L 25/16 (2006.01); H01F 27/24 (2006.01); H01F 27/29 (2006.01); H01F 27/40 (2006.01); H01F 27/02 (2006.01); H05K 3/34 (2006.01); H01L 23/24 (2006.01); H01L 23/31 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01F 27/022 (2013.01); H01F 27/24 (2013.01); H01F 27/29 (2013.01); H01F 27/40 (2013.01); H01L 23/645 (2013.01); H01L 25/16 (2013.01); H01F 27/027 (2013.01); H01L 23/24 (2013.01); H01L 23/3121 (2013.01); H01L 23/552 (2013.01); H01L 24/73 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01); H05K 3/3421 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10537 (2013.01); H05K 2201/10924 (2013.01); Y02P 70/611 (2015.11); Y10T 29/49146 (2015.01);
Abstract
The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.