The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Apr. 29, 2013
Applicants:

Furui Precise Component (Kunshan) Co., Ltd., Kunshan, CN;

Foxconn Technology Co., Ltd., New Taipei, TW;

Inventors:

Yi-Chang Liu, New Taipei, TW;

Jui-Wen Hung, New Taipei, TW;

Jian-Zhong Lu, Kunshan, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 23/427 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); H01L 23/427 (2013.01); H01L 23/467 (2013.01); H01L 2023/4087 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.


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