The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Sep. 17, 2014
Frank Ernst, Votrum-Mullem, NL;
Rogier Evertsen, Arnhem, NL;
Raph Pieters, Bergen, NL;
Mark Müller, Bietigheim-Bissingen, DE;
Guido Knippels, Schijndel, NL;
Frank Ernst, Votrum-Mullem, NL;
Rogier Evertsen, Arnhem, NL;
Raph Pieters, Bergen, NL;
Mark Müller, Bietigheim-Bissingen, DE;
Guido Knippels, Schijndel, NL;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
A method of singulating a semiconductor wafer with laser energy while the semiconductor wafer is supported on a mounting tape during singulation comprises the step of depositing a coating material onto a portion of the mounting tape adjacent to a perimeter of the semiconductor wafer to form a protective layer over the mounting tape. The semiconductor wafer is then cut with a laser beam such that the laser beam at least partially impinges upon the protective layer during cutting of the semiconductor wafer. After singulation of the semiconductor wafer, the protective layer is removed from the mounting tape.