The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 2016
Filed:
Jul. 17, 2014
Applicant:
Macronix International Co., Ltd., Hsinchu, TW;
Inventors:
Zusing Yang, Hsinchu, TW;
An Chyi Wei, Hsinchu, TW;
Assignee:
Macronix International Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01); H01L 21/311 (2006.01); H01L 21/3205 (2006.01); H01L 21/027 (2006.01); H01L 21/02 (2006.01); H01L 21/3213 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0276 (2013.01); H01L 21/0217 (2013.01); H01L 21/31111 (2013.01); H01L 21/31116 (2013.01); H01L 21/32133 (2013.01); H01L 27/11551 (2013.01); H01L 27/11578 (2013.01);
Abstract
High-aspect ratio trenches in integrated circuits are fabricated of composite materials and with trench boundaries having pencil-like etching profiles. The fabrication methods reduce surface tension between trench boundaries and fluids applied during manufacture, thereby avoiding pattern bending, bowing, and collapse. The method, further, facilitates fill-in of trenches with suitable selected materials.