The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2016

Filed:

Jun. 22, 2012
Applicants:

Shambhu N. Roy, Fremont, CA (US);

Vincent E. Burkhart, Cupertino, CA (US);

Natan Solomon, Sunnyvale, CA (US);

Sanjay Gopinath, Fremont, CA (US);

Kaihan Abidi Ashtiani, Cupertino, CA (US);

Bart Van Schravendijk, Sunnyvale, CA (US);

Jason Stevens, Los Altos, CA (US);

Dhritiman Subha Kashyap, Bangalore, IN;

David Cohen, San Jose, CA (US);

Inventors:

Shambhu N. Roy, Fremont, CA (US);

Vincent E. Burkhart, Cupertino, CA (US);

Natan Solomon, Sunnyvale, CA (US);

Sanjay Gopinath, Fremont, CA (US);

Kaihan Abidi Ashtiani, Cupertino, CA (US);

Bart van Schravendijk, Sunnyvale, CA (US);

Jason Stevens, Los Altos, CA (US);

Dhritiman Subha Kashyap, Bangalore, IN;

David Cohen, San Jose, CA (US);

Assignee:

Novellus Systems, Inc., Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05B 1/14 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45565 (2013.01); C23C 16/45574 (2013.01);
Abstract

A dual-plenum showerhead for semiconductor processing operations is provided. The showerhead may include a faceplate with two sets of gas distribution holes, each set fed by a separate plenum. One set of gas distribution holes may be through-holes in the faceplate of the showerhead and may allow gases trapped between the faceplate and a plasma dome to flow towards a wafer. The other set of gas distribution holes may distribute gas routed through passages or channels in the faceplate towards the wafer. The passages or channels in the faceplate may include radial channels and annular channels and may be fed from an annular gas distribution channel about the periphery of the faceplate.


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