The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Mar. 13, 2015
Applicant:

Macronix International Co., Ltd., Hsinchu, TW;

Inventors:

Ching-Lin Chan, Huwei Township, TW;

Cheng-Chi Lin, Toucheng Township, TW;

Yu-Chin Chien, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/73 (2006.01); H01L 29/739 (2006.01); H01L 29/10 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7393 (2013.01); H01L 29/0642 (2013.01); H01L 29/0696 (2013.01); H01L 29/1095 (2013.01); H01L 29/66325 (2013.01); H01L 29/66681 (2013.01); H01L 29/7816 (2013.01);
Abstract

A semiconductor device includes a substrate having a first conductivity type, a high-voltage well having a second conductivity type and formed in the substrate, a source well having the first conductivity type and formed in the high-voltage well, a source region formed in the source well, an isolation layer formed above the high-voltage well and spaced apart from the source well, a gate layer formed above the substrate and continuously extending from above an edge portion of the source well to an edge portion of the isolation layer, and a metal layer formed above the substrate and the isolation layer. The metal layer includes a first metal portion overlapping an edge portion of the gate layer and a side portion of the isolation layer, a second metal portion overlapping and conductively contacting the gate layer, and a third metal portion overlapping and conductively contacting the source region.


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