The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Jan. 14, 2015
Applicant:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Inventors:

Liqun Zhang, Beijing, CN;

Huilin Ma, Beijing, CN;

Jing Zhang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 27/105 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42328 (2013.01); H01L 21/28273 (2013.01); H01L 27/11521 (2013.01); H01L 27/11541 (2013.01); H01L 29/66825 (2013.01);
Abstract

A method of manufacturing an embedded split-gate flash memory device is provided. The method includes: performing shallow trench isolation and chemical mechanical planarization on a semiconductor substrate comprising a flash memory region and a logic region, wherein a first oxide is formed on the semiconductor substrate and a first nitride is formed on the first oxide; forming a first photoresist over the logic region, and removing the first nitride disposed in the flash memory region; removing the first photoresist, and depositing a floating gate polysilicon material over the semiconductor substrate; performing chemical mechanical planarization on the floating gate polysilicon material; forming a control gate in the flash memory region; etching the floating gate polysilicon material to form a floating gate; forming a second photoresist over the flash memory region, and removing the first oxide and the first nitride disposed in the logic region; and removing the second photoresist.


Find Patent Forward Citations

Loading…