The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2016
Filed:
Oct. 29, 2015
Applicant:
Via Technologies, Inc., New Taipei, TW;
Inventors:
Sheng-Yuan Lee, New Taipei, TW;
Yin-Ku Chang, New Taipei, TW;
Assignee:
VIA TECHNOLOGIES, INC., New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/02 (2006.01); H01L 27/07 (2006.01); H01L 49/02 (2006.01); H01L 23/528 (2006.01); H01L 27/06 (2006.01); H01L 29/93 (2006.01); H01L 29/94 (2006.01); H01L 23/522 (2006.01); H01L 27/08 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0288 (2013.01); H01L 23/528 (2013.01); H01L 23/5223 (2013.01); H01L 23/5225 (2013.01); H01L 23/5227 (2013.01); H01L 27/0641 (2013.01); H01L 27/0788 (2013.01); H01L 27/0805 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H01L 28/60 (2013.01); H01L 29/93 (2013.01); H01L 29/94 (2013.01); H01L 23/5283 (2013.01);
Abstract
The invention provides an integrated circuit device. The integrated circuit device includes a substrate. A first capacitor is disposed on the substrate. A first metal pattern is coupled to a first electrode of the first capacitor. A second metal pattern is coupled to a first electrode of the second capacitor. A third metal pattern is disposed over the first and second metal patterns. The third metal pattern covers the first capacitor, the first metal pattern, and the second metal pattern. The third metal pattern is electrically grounded. An inductor is disposed over the third metal pattern.