The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2016
Filed:
May. 30, 2012
Applicant:
Bernhard Rebhan, Haag am Hausruck, AT;
Inventor:
Bernhard Rebhan, Haag am Hausruck, AT;
Assignee:
EV GROUP E. THALLNER GMBH, St. Florian am Inn, AT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01); B23K 37/04 (2006.01); H01L 23/00 (2006.01); H01L 21/67 (2006.01); B23K 20/14 (2006.01); B23K 20/24 (2006.01); B23K 20/26 (2006.01); B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); B23K 20/14 (2013.01); B23K 20/24 (2013.01); B23K 20/26 (2013.01); B23K 31/02 (2013.01); B23K 37/00 (2013.01); H01L 21/67092 (2013.01); H01L 2224/751 (2013.01); H01L 2224/757 (2013.01); H01L 2224/758 (2013.01); H01L 2224/7525 (2013.01); H01L 2224/81065 (2013.01); H01L 2224/83065 (2013.01); H01L 2224/94 (2013.01); H01L 2924/1461 (2013.01);
Abstract
A device for bonding of one bond side of a first substrate to one bond side of a second substrate, the device having one module group with a common working space which can be closed especially gastight to the environment, at least one bond module is connected in a sealed manner to the working space, and a movement apparatus for moving the first and second substrate in the working space. The module group has a reduction module which is connected, in a sealed manner to the working space for reducing the bond sides.