The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

Nov. 09, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Yanping Shen, Saratoga Springs, NY (US);

Min-hwa Chi, Malta, NY (US);

Ashish Kumar Jha, Saratoga Springs, NY (US);

Haiting Wang, Clifton Park, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8238 (2006.01); H01L 29/66 (2006.01); H01L 21/28 (2006.01); H01L 21/3215 (2006.01); H01L 21/3213 (2006.01); H01L 27/092 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823828 (2013.01); H01L 21/28088 (2013.01); H01L 21/3215 (2013.01); H01L 21/32134 (2013.01); H01L 21/823821 (2013.01); H01L 27/0924 (2013.01); H01L 29/4966 (2013.01); H01L 29/66545 (2013.01);
Abstract

A method of removing RMG sidewall layers, and the resulting device are provided. Embodiments include forming a TiN layer in nFET and pFET RMG trenches; forming an a-Si layer over the TiN layer; implanting Overtically in the a-Si layer; removing the a-Si layer and TiN layer from the side surfaces of the RMG trenches followed by the a-Si layer from the bottom surfaces; forming a TiN layer in the RMG trenches; forming a a-Si layer over the TiN layer; implanting Overtically in the a-Si layer; removing the a-Si layer and TiN layer from the side surfaces of the RMG trenches, the a-Si layer from the bottom surfaces, and a remainder of the TiN layer from only the nFET RMG trench; forming a Ti layer in the RMG trenches; implanting Al or C in the Ti layer vertically and annealing; and filling the RMG trenches with Al or W.


Find Patent Forward Citations

Loading…