The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 2016

Filed:

May. 16, 2012
Applicants:

Rainer Minixhofer, Unterpremstätten, AT;

Ewald Stückler, Unterpremstätten, AT;

Martin Schrems, Eggersdorf, AT;

Günther Koppitsch, Lieboch, AT;

Jochen Kraft, Oberaich, AT;

Jordi Teva, Eindhoven, NL;

Inventors:

Rainer Minixhofer, Unterpremstätten, AT;

Ewald Stückler, Unterpremstätten, AT;

Martin Schrems, Eggersdorf, AT;

Günther Koppitsch, Lieboch, AT;

Jochen Kraft, Oberaich, AT;

Jordi Teva, Eindhoven, NL;

Assignee:

AMS AG, Unterpremstaetten, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76877 (2013.01); H01L 21/76802 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A cutout (), which penetrates the semiconductor body, is present in the semiconductor body (). A conductor layer (), which is electrically conductively connected to a metal plane () on or over the semiconductor body, screens the semiconductor body electrically from the cutout. The conductor layer can be metal, optionally with a barrier layer (), or a doped region of the semiconductor body.


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