The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2016
Filed:
Sep. 19, 2011
Tomomichi Ichikawa, Nagaokakyo, JP;
Yasunori Hioki, Nagaokakyo, JP;
Norihiro Yoshikawa, Nagaokakyo, JP;
Ichiro Nakamura, Nagaokakyo, JP;
Shinichi Kobayashi, Nagaokakyo, JP;
Ichiro Nakaso, Nagaokakyo, JP;
Tomomichi Ichikawa, Nagaokakyo, JP;
Yasunori Hioki, Nagaokakyo, JP;
Norihiro Yoshikawa, Nagaokakyo, JP;
Ichiro Nakamura, Nagaokakyo, JP;
Shinichi Kobayashi, Nagaokakyo, JP;
Ichiro Nakaso, Nagaokakyo, JP;
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Abstract
To increase the heat resistance of a film capacitor, a dielectric resin composition is used as a material for a dielectric resin film used in a film capacitor, the dielectric resin composition being cured by mixing and crosslinking two or more organic materials having functional groups that react with each other to provide a cured article. At least one pair highly cohesive atomic groups which has a molecular cohesive energy equal to or higher than that of a methyl group and capable of cohering with each other due to the molecular cohesive energy is linked to the organic material. The highly cohesive atomic groups form a cohesive portion serving as pseudo-crosslinking.