The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Feb. 10, 2014
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Ursula Hedenig, Villach, AT;

Daniel Maurer, Feld am See, AT;

Thomas Grille, Villach, AT;

Peter Irsigler, Obernberg/Inn, AT;

Soenke Pirk, Villach, AT;

Andre Brockmeier, Villach, AT;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 31/00 (2006.01); H04R 23/00 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
H04R 31/00 (2013.01); H04R 19/005 (2013.01); H04R 23/00 (2013.01); H04R 2201/003 (2013.01); Y10T 29/49 (2015.01);
Abstract

In various embodiments, a method for manufacturing microphone structures is provided. The method may include: Providing a substrate having a front side and a back side, the backside facing away from the front side, and having an inner area and an outer area laterally surrounding the inner area, with the inner area comprising a plurality of microphone areas each microphone are being provided for one microphone of the plurality of microphones; Forming a plurality of layers for the plurality of microphones in the microphone areas on the front side of the substrate; Forming a recess from the backside of the substrate with the recess laterally overlapping the entire inner area; Forming a plurality of cavities into a bottom of the recess with each cavity of the plurality of cavities being formed in one of the microphone areas; Processing the layers to form the plurality of microphone structures, wherein each microphone structure comprises at least one layer of the plurality of layers and one cavity; and Separating the plurality of microphone structures from each other.


Find Patent Forward Citations

Loading…