The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Dec. 13, 2013
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Byung Mok Kim, Seoul, KR;

Young Jin No, Seoul, KR;

Bo Hee Kang, Seoul, KR;

Hiroshi Kodaira, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/12 (2006.01); H01L 27/32 (2006.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/48 (2013.01); H01L 23/3677 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 24/45 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48235 (2013.01); H01L 2224/48455 (2013.01); H01L 2224/48997 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85951 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12035 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15183 (2013.01); H01L 2924/15787 (2013.01);
Abstract

Disclosed is a light emitting device package including a package body including at least one electrode pad disposed on a surface thereof, a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, and a via hole electrode passing through the package body, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, the light emitting device package further includes a bonding ball disposed on the stitch, and the via hole electrode non-overlaps the stitch and the bonding ball in a vertical direction.


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