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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9437777 B1

PDFFull Text
Date of Patent:
Sep. 06, 2016

Filed:

Jun. 17, 2014

Semiconductor device with antenna and light-emitting element

Applicant:

Semiconductor Energy Laboratory Co., Ltd., Atsugi-shi, Kanagawa-ken, JP;

Inventors:

Tamae Takano, Atsugi, JP;

Nobuharu Ohsawa, Zama, JP;

Kiyoshi Kato, Atsugi, JP;

Assignee:

Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken, JP;

Attorneys:

Robinson Intellectual Property Law Office

Eric J. Robinson

Primary Examiner:

Shouxiang Hu

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 35/24 (2006.01); H01L 29/00 (2006.01); H01L 33/36 (2010.01); H01L 51/50 (2006.01); H01L 51/52 (2006.01); H01L 23/522 (2006.01); H01L 27/06 (2006.01); H01L 27/12 (2006.01); H01L 27/13 (2006.01); H01Q 1/22 (2006.01); H01Q 9/27 (2006.01); H01L 51/05 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01F 5/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/36 (2013.01); H01L 23/49838 (2013.01); H01L 23/5227 (2013.01); H01L 23/66 (2013.01); H01L 27/0688 (2013.01); H01L 27/1203 (2013.01); H01L 27/1214 (2013.01); H01L 27/1255 (2013.01); H01L 27/13 (2013.01); H01L 51/05 (2013.01); H01L 51/5012 (2013.01); H01L 51/5203 (2013.01); H01Q 1/2283 (2013.01); H01Q 9/27 (2013.01); H01F 5/003 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/12044 (2013.01); Y10S 257/922 (2013.01);
Abstract

When a conductive layer occupying a large area is provided in a coiled antenna portion, it has been difficult to supply power stably. A memory circuit portion and a coiled antenna portion are disposed by being stacked together; therefore, it is possible to prevent a current from flowing through a conductive layer occupying a large area included in the memory circuit portion, and thus, power saving can be achieved. In addition, the memory circuit portion and the coiled antenna portion are disposed by being stacked together, and thus, it is possible to use a space efficiently. Therefore, downsizing can be realized.

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