The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Mar. 23, 2015
Applicant:

Advanced Semiconductor Engineering, Inc., Kaosiung, TW;

Inventors:

Tau-Jing Yang, Kaohsiung, TW;

Kuo-Feng Huang, Kaohsiung, TW;

Wei Yu Nien, Kaohsiung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/552 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 23/3157 (2013.01); H01L 23/5386 (2013.01); H01L 23/552 (2013.01); H01L 25/50 (2013.01);
Abstract

A semiconductor device package includes a substrate, a first electrical component, a second electrical component, and a conductive frame disposed on a top surface of the substrate. The conductive frame has a top portion and a rim substantially perpendicular to the top portion. The conductive frame covers the first electrical component, and includes at least one opening in the top portion of the conductive frame, one of which openings exposes the second electrical component. A top surface of the top portion of the conductive frame is substantially coplanar with a top surface of the second electrical component. The semiconductor device package further includes an electromagnetic interference shield in contact with the top surface of the top portion of the conductive frame, an outer lateral surface of the rim of the conductive frame, and the top surface of the second electrical component.


Find Patent Forward Citations

Loading…