The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Apr. 20, 2015
Rohm Co., Ltd., Kyoto, JP;
Katsumi Sameshima, Kyoto, JP;
ROHM CO., LTD., Kyoto, JP;
Abstract
A semiconductor device includes a semiconductor chip, a wiring on the chip, an insulating film coating the wiring and having an opening partially exposing the wiring, a Ti/W film on a portion of the wiring facing the opening, a Cu layer on the Ti/W film and the wiring's exposed portion, and having a peripheral edge protruding away from the opening more than Ti/W film's peripheral edge in parallel to an insulating film surface, and a solder ball bonded to the Cu layer. The protrusion of the Cu layer's peripheral edge with respect to the Ti/W film's peripheral edge is greater than the Ti/W film's thickness. The Ti/W film's surface doesn't vertically surpass the Cu layer's upper surface in the opening's center. A Cu layer/solder ball interface is arc-shaped on both sides of the Cu layer's upper surface in a cross section taken perpendicularly to the Cu layer's upper surface.