The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2016
Filed:
Jul. 08, 2014
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3205 (2006.01); H01L 21/764 (2006.01); H01L 21/28 (2006.01); H01L 27/115 (2006.01);
U.S. Cl.
CPC ...
H01L 21/764 (2013.01); H01L 21/28273 (2013.01); H01L 27/11524 (2013.01); H01L 27/11541 (2013.01); H01L 27/11543 (2013.01);
Abstract
In one embodiment, a method of manufacturing a semiconductor device includes forming a pattern portion and a flat portion on a substrate, the pattern portion including plural patterns, and the flat portion having a flat surface at a position lower than upper surfaces of the patterns. The method further includes transferring a first film on the substrate to continuously form the first film on the upper surfaces of the patterns and on the flat surface of the flat portion and to form a first air gap between the patterns.