The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Aug. 30, 2013
Applicant:

Mediatek Inc., Hsin-Chu, TW;

Inventors:

Wen-Sung Hsu, Zhubei, TW;

Ming-Chieh Lin, Jhubei, TW;

Ta-Jen Yu, Taichung, TW;

Assignee:

MEDIATEK INC., Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4828 (2013.01); H01L 21/481 (2013.01); H01L 21/565 (2013.01); H01L 23/49811 (2013.01); H01L 23/49861 (2013.01); H01L 24/11 (2013.01); H01L 23/3114 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/11912 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/814 (2013.01); H01L 2224/8146 (2013.01); H01L 2224/81411 (2013.01); H01L 2224/81416 (2013.01); H01L 2224/81424 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81455 (2013.01); H01L 2924/181 (2013.01);
Abstract

According to an embodiment of the present invention, a chip package is provided. The chip package includes: a patterned conducting plate having a plurality of conducting sections electrically separated from each other; a plurality of conducting pads disposed on an upper surface of the patterned conducting plate; a chip disposed on the conducting pads; a plurality of conducting bumps disposed on a lower surface of the patterned conducting plate, wherein each of the conducting bumps is electrically connected to a corresponding one of the conducting sections of the patterned conducting plate; and an insulating support layer partially surrounding the conducting bumps.


Find Patent Forward Citations

Hsu, Wen-Sung. (2016). Chip package having a patterned conducting plate and method for forming the same (U.S. Patent No. 9437457). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9437457

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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