The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Sep. 28, 2012
Applicant:

Jsr Corporation, Tokyo, JP;

Inventors:

Satoshi Dei, Tokyo, JP;

Takashi Mori, Tokyo, JP;

Kazunori Takanashi, Tokyo, JP;

Assignee:

JSR Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); C08G 77/388 (2006.01); G03F 7/075 (2006.01); G03F 7/004 (2006.01); G03F 7/09 (2006.01); G03F 7/11 (2006.01); H05K 3/06 (2006.01); C08G 77/14 (2006.01); C08G 77/24 (2006.01); C09D 183/08 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00396 (2013.01); B81C 1/00388 (2013.01); C08G 77/14 (2013.01); C08G 77/24 (2013.01); C08G 77/388 (2013.01); C09D 183/08 (2013.01); G03F 7/0046 (2013.01); G03F 7/0752 (2013.01); G03F 7/0757 (2013.01); G03F 7/094 (2013.01); G03F 7/11 (2013.01); H05K 3/061 (2013.01); B81C 2201/0198 (2013.01); H05K 2203/05 (2013.01);
Abstract

A pattern-forming method in which processibility of a silicon-containing film in etching with a fluorine gas and resistance against etching with an oxygen gas can be together improved in a multilayer resist process to form a finer pattern. Provided is a pattern-forming method that includes the steps of (1) providing a silicon-containing film on the upper face side of a substrate to be processed using a polysiloxane composition; (2) forming a resist pattern on the silicon-containing film; (3) dry-etching the silicon-containing film using the resist pattern as a mask to form a silicon-containing pattern; and (4) dry-etching the substrate to be processed using the silicon-containing pattern as a mask to form a pattern, in which the polysiloxane composition includes (A) a polysiloxane containing a fluorine atom, and (B) a crosslinking accelerator.


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