The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Jun. 26, 2014
Applicant:

Stmicroelectronics, Inc., Coppell, TX (US);

Inventors:

Ming Fang, Plano, TX (US);

Fuchao Wang, Plano, TX (US);

Assignee:

STMICROELECTRONICS, INC., Coppell, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F24H 1/18 (2006.01); F24H 1/20 (2006.01); B41J 2/05 (2006.01); B41J 2/16 (2006.01); B41J 2/14 (2006.01);
U.S. Cl.
CPC ...
B41J 2/16 (2013.01); B41J 2/14056 (2013.01); B41J 2/14072 (2013.01); B41J 2/14137 (2013.01); B41J 2/1601 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1639 (2013.01); Y10T 29/41 (2015.01); Y10T 29/49401 (2015.01); Y10T 29/49826 (2015.01);
Abstract

An integrated semiconductor heating assembly includes a semiconductor substrate, a chamber formed therein, and an exit port in fluid communication with the chamber, allowing fluid to exit the chamber in response to heating the chamber. The integrated heating assembly includes a first heating element adjacent the chamber, which can generate heat above a selected threshold and bias fluid in the chamber toward the exit port. A second heating element is positioned adjacent the exit port to generate heat above a selected threshold, facilitating movement of the fluid through the exit port away from the chamber. Addition of the second heating element reduces the amount of heat emitted per heating element and minimizes thickness of a heat absorption material toward an open end of the exit port. Since such material is expensive, this reduces the manufacturing cost and retail price of the assembly while improving efficiency and longevity thereof.


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