The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 06, 2016

Filed:

Jun. 21, 2013
Applicant:

Fujimi Incorporated, Kiyosu-shi, JP;

Inventors:

Mikikazu Shimizu, Komaki, JP;

Tomohiko Akatsuka, Ichinomiya, JP;

Kazuya Sumita, Kakamigahara, JP;

Assignee:

Fujimi Incorporated, Kiyosu-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/04 (2012.01); C09G 1/02 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
B24B 37/044 (2013.01); C09G 1/02 (2013.01); H01L 21/3212 (2013.01);
Abstract

The present invention provides a polishing composition that can be suitably used in polishing of polysilicon, and a polishing method using the polishing composition. The polishing composition contains a nitrogen-containing nonionic surfactant and abrasive grains and has a pH of 9 to 12. The content of the nitrogen-containing nonionic surfactant in the polishing composition is preferably 20 to 500 ppm. The abrasive grains contained in the polishing composition are preferably colloidal silica. The average primary particle diameter of the abrasive grains contained in the polishing composition is preferably 10 to 90 nm. The content of the abrasive grains in the polishing composition is preferably 1.0 to 5.0% by mass.


Find Patent Forward Citations

Loading…