The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Jul. 23, 2013
Applicant:
Ibiden Co., Ltd., Ogaki-shi, JP;
Inventor:
Naoto Ishida, Ogaki, JP;
Assignee:
IBIDEN Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/20 (2006.01); H05K 3/40 (2006.01); H05K 3/10 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4038 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H05K 3/10 (2013.01); H05K 3/4602 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 2924/0002 (2013.01); H05K 3/4682 (2013.01); H05K 2201/096 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09563 (2013.01); Y10T 29/49155 (2015.01); Y10T 29/49165 (2015.01);
Abstract
A method for manufacturing a printed wiring board includes forming on a support sheet an intermediate body including a first insulation layer, a second insulation layer and a first conductive layer interposed between the first insulation layer and the second insulation layer, and separating the support sheet from the intermediate body including the insulation layer, the first conductive layer and the second insulation layer such that the intermediate body is detached from the support sheet.