The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Nov. 06, 2013
Applicants:
Chin-sheng Wang, Hsinchu County, TW;
Ching-sheng Chen, Hsinchu County, TW;
Chao-min Wang, Hsinchu, TW;
Inventors:
Chin-Sheng Wang, Hsinchu County, TW;
Ching-Sheng Chen, Hsinchu County, TW;
Chao-Min Wang, Hsinchu, TW;
Assignee:
Subtron Technology Co., Ltd., Hsinchu County, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 3/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/007 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48228 (2013.01); H01L 2924/15311 (2013.01); H05K 3/3452 (2013.01); H05K 2201/0376 (2013.01); H05K 2203/0156 (2013.01);
Abstract
A package carrier including a removable supporting plate and a circuit board is provided. The removable supporting plate includes a dielectric layer, a copper foil layer and a releasing layer. The dielectric layer is disposed between the copper foil layer and the releasing layer. The circuit board is disposed on the removable supporting plate and directly contacts the releasing layer. A thickness of the circuit board is between 30 μm and 100 μm.